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A6300
series
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Continuous Atmospheric Pressure CVD System
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A superior level of safety is
offered in A6300 (Type S).
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Excellent film thickness consistency
Space saving with downsized footprint
W1500 x D2850 x H2000(mm)
High throughput
Dual-lane transfer system
Better operating rate
Improvement in MTBF (mean time between failures)
and MTTR (mean time to repair)
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A6300 appearance
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| Features |
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Designed
for φ100- to φ150-mm wafers |
| High
throughput |
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Outstanding hourly wafer
process is realized, 120 wafers per hour. (Standard film thickness:
1,000 to 8,000 Å) |
| Low TCO |
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The actualization of low
cost yields reductions in Total Cost of Ownership (TCO) with high
throughput and high performance assured. Also with an improved transfer
system utilized, the minimization of the number of trays has been
accomplished (compared with our conventional models). |
| High
performance |
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A6300 is endowed the new
gas dispersion head, new linear carrier, and new exhaust system
that contribute to excellent film thickness consistency.
A high degree of safety and the shortening of maintenance time are
delivered. |
| High
maintainability |
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The adoption of various
new systems yields high maintainability. The utilization of the
automatic tray exchanger offers a high degree of safety and the
shortening of maintenance time. |
| Anti-metal contamination
measures |
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A6300 is equipped with
the metal-free parts for areas that come into contact with wafers
and SiC tray. |
| Space saving |
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A6300 requires a footprint
30% smaller than our AEC series, and 20% smaller than AMAX series.
(1,500mm (W) x 2,850mm (D) x 2,000mm (H)) |
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| Performance |
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Throughput:
120 wafers/hr; Two-wafer process is permitted on one tray. |
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Excellent
film thickness consistency |
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Optional functions
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Multiple
wafer-size process (φ100mm/ φ125mm/
φ150mm)
2 sizes are available (E.g.: Dual process of φ125- and φ150-mm
wafers)
The minimization of the exchange area in wafer size change,
which contributes to cost cutting
No tray exchange is necessary in response to change in wafer size.
(not applied to all)
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