      
|
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AEC
series
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Continuous Atmospheric Pressure CVD System
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| Features |
|
Designed for φ75-
to φ150-mm
wafers
High throughput
Reasonable initial investment and low maintenance/operation cost
BPSG, PSG, NSG deposition enabled
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| Performance |
|
Throughput: 100 wafers/hr
(φ150-mm wafers) |
|
Excellent film thickness
consistency (Max. 3mm around a wafer) and impurity concentration
uniformity |
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Optional functions
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Multiple wafer-size process (φ100mm/φ125mm/φ150mm)
The minimization of the exchange area in wafer size change, which
contributes to cost cutting
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 |
|
AEC load port
4-cassette model
4 cassettes assigned on the loading side and unloading side each
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