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AMAX200/800
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Continuous Atmospheric Pressure CVD System
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Designed for deposition of USG,
PSG, and BPSG interlayer dielectric with the application of monosilane
gas reactivity and back deposition on silicon substrates.
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| Features |
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Multiple
wafer-size-capable CVD system (AMAX200 for φ150-mm wafers, AMAX800
for φ200-mm wafers) |
| Metal contamination
minimized (compared with other companies): Up to 1E9 atoms/cm2 |
| Reasonable
initial investment and low maintenance/operation cost |
| BPSG, PSG,
NSG deposition enabled |
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| Performance |
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Throughput:
55 wafers/hr (AMAX800) 57 wafers/hr (AMAX200) |
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Excellent
film thickness consistency (Max. 3mm around a wafer) and impurity
concentration uniformity |
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Optional functions
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Multiple
wafer-size process (φ125mm/ φ150mm/ φ200mm）
The minimization of the exchange area in wafer size change,
which contributes to cost cutting
Wafer counterbore lock-in unit
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