WULF series

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Spin type cleaning system compatible with high definition photomask

High speed diffusion of fluid to the cleaning surface
Rapid elimination of contamination and reaction products
Water markless drying

Feature

With the advancement of LSI performance, photomasks and reticles are required to have higher definition and precision.
Our cleaning system contributes to the high clean and yield improvement of these products and cooperates in the production of more complete products.
Equipped with a spin cleaning unit using functional water,
This unit is capable of removing organic matter, metal ion and contamination up to the detection limit level by centrifugal force of work rotation and discharge of ozone water and ammonia added hydrogen water.
By switching and cleaning each solution, it is an environment-friendly tool that can remove impure deposits on the workpiece at high speed, and at the same time manage waste liquid.
Adoption of cleaning solution and method to replace RCA cleaning solution,
SPM → Ozone water
・ Realization of complete room temperature cleaning
(high temperature process unnecessary),
・ Chemical solution residual amount reduction on mask,
・ Securing waste solution treatment (ISO14000 measure),

SC-1 → Hydrogen water (ammonia added)
・ Etching prevention of MoSi halftone mask,

Performance

The following performance table shows the results obtained when cleaning is performed using functional water, such as Ozone water or Ammonia-added Hydrogen water,without the use of chemical solutions such as SPM (Sulfuric acid + hydrogen peroxide) or SC-1 (Ammonia water + hydrogen peroxide + DIW).

PSM final clean (SPM free)
Category	No.	Item	Specification
Blank	1	Particle Free	＞32nm
Blank	2	PRE%	≧95%
Image Layer (pattern side)	3	Remaining Soft defect on QZ	≧0.05um (Yield : 98%)
	4	Remaining Soft defect on Shifter	≧0.05um, ≦10ea (Yield : 98%)
	5	SRAF (Dark) missing	No missing
	6	Pattern damage, ESD, Scratch	No damage
	7	Shifter change (Phase)	≦-0.2 degree, average by 10X clean
	8	Shifter change (Trans.)	≦0.025%, average by 10X clean
	9	Shifter change (CD mean)	≦0.15nm, average by 10X clean
	10	Shifter change (CD Range)	≦0.5nm, average by 10X clean
Ion residues	11	Chemical residue (SO4)	≦0.5 ppb
Ion residues	12	Chemical residue (NH4)	≦17.0 ppb

Outline specification

Size

Cleaning device body	7300㎜(W) x 1410㎜(D) x 2300㎜(H)
Power BOX	1400㎜(W) x 500㎜(D) x 2150㎜(H)
Chemical BOX	2500㎜(W) x 700㎜(D) x 2000㎜(H)
Filter BOX	2600㎜(W) x 700㎜(D) x 2000㎜(H)
Hot DIW Unit	1250㎜(W) x 550㎜(D) x 1750㎜(H)
H2 water・CO2 water Unit	1050㎜(W) x 1500㎜(D) x 2000㎜(H)
O3 water Unit	570㎜(W) x 850㎜(D) x 2000㎜(H)

Utility	Three phase 200V & Single phase 100V DIW & Cooling water Clean dry air & Nitrogen gas General exhaust, Acid exhaust & Alkaline exhaust

Service Division

TEL:+81-42-552-7384